Combined Glossary Table
| term | description | facets | | 5/5 | 5mil minimum traces & 5mil minimum spacing | 
| 6/5 | 6mil minimum traces & 5mil minimum spacing | 
| AMC | aluminum metal core | 
| ACY | 
| additive | 
| Adhesive | 
| Altium | 
| Annular Ring | 
| Annulus | 
| AOI automatic optical inspection | 
| Aperture | 
| Arc | 
| Array | 
| assembly | 
| AutoCAD | 
| autorouter | 
| Autotrax | 
| Autotrax | 
| AXI automated x-ray inspection | 
| Axial | 
| Bakelite | 
| BGA | 
| Blind Via | 
| bloat | 
| board house | 
| Board Thickness | 
| Breadboard | 
| buffer | 
| Buried Via | 
| bus | 
| C4 Controlled collapse chip connection | 
| CAD | 
| CAM files | 
| CAM | 
| Capture | 
| Card Edge connector | 
| Castellations | 
| CEM-1 | 
| CEM-3 | 
| Centroid | 
| centroid | 
| Chip Scale Package | 
| clad | 
| Clearance | 
| Coating (Spin, Roll, Film) | 
| COB | 
| Component Side | 
| Component | 
| Computer Aided Design | 
| Computer Aided Machining | 
| Conformal Coating | 
| Conformal coating | 
| connect | 
| Copper Foil | 
| Copper weight | 
| Copper | 
| copper | 
| courtyard | 
| cte coefficient of thermal expansion (see tce) | 
| Curve, open | 
| delamination | 
| DFSM Dry film soldermask | 
| Dialectric | 
| Diameter | 
| Dielectric | 
| differential pair | 
| DIP | 
| Discrete Component | 
| double-sided | 
| DRC design rule check | 
| Drill file | 
| Eagle | 
| EDF | 
| EDI Electronic Data Interchange | 
| Endpoint | 
| ENIG Electroless Nickel Immersion Gold | 
| epoxy resin | 
| ESD Electrostatic Discharge | 
| Etching | 
| Excellon | 
| explicit layer | 
| fabrication fab | 
| Feedthrough Via | 
| fidocad | 
| Fiducial | 
| Finger | 
| Finite Element Filter | 
| Fixture | 
| flags | 
| Flex | 
| Flip chip | 
| flood fill | 
| Flux | 
| Flying probe | 
| Foil | 
| font | 
| Footprint | 
| FR-1 | 
| FR-2 | 
| FR-3 | 
| FR-4 | 
| Gcode | 
| gEDA | 
| Gerber | 
| grid snap | 
| grid-pitch | 
| grid | 
| Hard Gold pcb surface finish (slip rings, fingers, etc) | 
| HASL Hot Air surface levelling | 
| High Density Interconnect(HDI) | 
| Hole | 
| Immersion Silver | 
| Immersion Tin | 
| implicit layer | 
| Integrated Circuit | 
| IPC (circa 1957) | 
| JIT | 
| Kapton | 
| KiCAD | 
| Knife | 
| Laminate | 
| Land | 
| Laser | 
| Layer Group | 
| Layer Sequence | 
| Layers (Physical) | 
| Layers (Virtual) | 
| Library | 
| Lihata | 
| mask | 
| Masonite | 
| Mentor | 
| Mil | 
| Milling | 
| milling | 
| Mirroring | 
| Mouse bites | 
| Multilayer | 
| neckdown | 
| negative process | 
| Negative transfer | 
| NEMA | 
| Net | 
| Netlist | 
| ODB++ | 
| OrCAD | 
| OSP Organic Solderability preservative | 
| outline | 
| Package | 
| Pad | 
| padstack | 
| Panel Service | 
| panel | 
| Panelization | 
| paste stencil | 
| paste | 
| Path | 
| pcb-rnd | 
| PCB | 
| PDIP | 
| phenolic resin | 
| Photoengraving | 
| Photoresist | 
| pick and place pnp | 
| Pin | 
| pinout | 
| pitch | 
| PLCC plastic lead chip carrier | 
| plotter | 
| Polygon hole | 
| Polygon, complex | 
| Polygon, concave | 
| Polygon, convex | 
| Polygon, irregular | 
| Polygon, regular | 
| Polygon, simple | 
| Polygon | 
| polygon | 
| positive process | 
| Positive transfer | 
| Protel | 
| PTH | 
| Pyralux AP | 
| Pyralux FR | 
| Pyralux LF | 
| QFP | 
| Radial Lead | 
| Raster | 
| rat | 
| Ratsnest | 
| refdes Reference Designator, https://en.wikipedia.org/wiki/Reference_designator | 
| reflow | 
| Registration | 
| resin | 
| resist | 
| RF | 
| Rigid-Flex | 
| Route and Retain | 
| routing style | 
| Routing | 
| routing | 
| RS-274D | 
| RS-274X | 
| Rubylithe | 
| Scoring | 
| Short | 
| Silk Screen | 
| Silk | 
| silk | 
| single-sided | 
| SIP | 
| slot | 
| SMD | 
| SMOBC soldermask over bare copper  prevent unintended flow of tin/lead during reflow | 
| SMT | 
| Snap | 
| SOIC | 
| Solder Side | 
| Solder | 
| STEP | 
| Subcircuit | 
| Substrate | 
| Subtractive | 
| Symbol | 
| Tape out | 
| TCE thermal coefficient of expansion | 
| tEDAx | 
| Tented(Via) | 
| terminal | 
| TG Glass transition temp | 
| Thermal Via Thermal relief | 
| Thou | 
| Tin Whisker | 
| Tin | 
| TinyCAD | 
| Tolerance | 
| tombstone | 
| tooling | 
| toolpath generator | 
| toolpath | 
| toporouter | 
| Trace | 
| TT toner transfer | 
| V-Cut aka v-scoring | 
| V-score | 
| Vcc | 
| Vdd | 
| Vector | 
| Via stitching | 
| Via | 
| Wave Solder | 
| Wire bonding | 
| XY |